Production method of multilayer electronic device
US7491283B2 · kind B2 · utility
2Cited by
5References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 26, 2003 |
| Grant date | Feb 17, 2009 |
| Priority date | — |
| Expiry date | Jun 18, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/308
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
At the time of pressing an electrode layer 12a against a surface of a green sheet 10a having a thickness of 3 μm or thinner to bond the electrode layer 12a with the surface of the green sheet 10a, an adhesive layer 28 having a thickness of 0.02 to 0.3 μm is formed on a surface of the electrode layer 12a or the surface of the green sheet 10a. It is possible to easily transfer a dry type electrode layer to the surface of the green sheet with high accuracy without breaking or deforming the green sheet.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.