Double-sided metallic laminate and method for manufacturing the same
US7491447B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2004 |
| Grant date | Feb 17, 2009 |
| Priority date | — |
| Expiry date | Aug 9, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to a double-sided metallic laminate for a printed circuit board and a method for manufacturing the same. The double-sided metallic laminate which comprises a metallic layer at one side, a resin layer of a polyimide for improving adhesion with a metal, a resin layer of a low expansion polyimide having a thermal expansion coefficient of 5×10−6 to 2.5×10−5/° C. and a metallic layer at the other side, has excellent flexibility and thermal resistance, can prevent curl and is securely laminated, particularly without the use of an adhesive. Therefore, it is suitable for a printed circuit board of a small size electric appliance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.