Light emitting device and manufacturing method thereof
US7491562B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 6, 2007 |
| Grant date | Feb 17, 2009 |
| Priority date | — |
| Expiry date | Sep 6, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K2102/3026
Abstract
In a light emitting device, it is preferable that a surface of a film below a light-emitting element has flatness. Therefore, treatment such as planarization of a surface of a film is performed after forming the film. The present invention proposes a structure of a light-emitting device that can make the foregoing planarization easier. The same layer as a wiring formed on a first film is used to manufacture a second film. Herewith, a portion of the first film below a light-emitting element can be prevented from being etched to form unevenness at a surface of the first film during the formation of the wiring. In addition, a surface of a third film is made higher by providing the second film to enable local planarization.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.