Glass lid, and package provided with such a lid, for the encapsulation of electronic components
US7492040B2 · kind B2 · utility
0Cited by
5References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 1, 2005 |
| Grant date | Feb 17, 2009 |
| Priority date | — |
| Expiry date | Dec 10, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K50/841
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The encapsulation lid comprises at least two glass layers of different compositions, a first layer called the bottom layer, which is continuous, and at least a second layer, which is discontinuous and designed so as to define cavities or anfractuosities in this lid. Preferably, the glass layers other than the first layer are preferably formed from low-melting-point frits, thereby allowing such lids to be manufactured economically, without recourse to glass machining.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.