Method and apparatus for measuring thickness and optical properties of a thin-film on a substrate
US7492467B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2007 |
| Grant date | Feb 17, 2009 |
| Priority date | — |
| Expiry date | Aug 7, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67253
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Various embodiments include a metrology tool comprising an emitter configured to emit an incident light beam at a production substrate including an ARL, a receiver configured to receive a reflected light beam from the production substrate, a spectrometer configured to determine a digital signal representing an intensity of a wavelength within the reflected light beam, and a processor configured to determine a spectrum of the reflected light beam from the digital signal, select a suppression band based on an expected wavelength representative of a portion of the ARL, and determine a property of the ARL based on a portion of the spectrum in the selected suppression band.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.