System and method for segmenting a structure of interest using an interpolation of a separating surface in an area of attachment to a structure having similar properties
US7492968B2 · kind B2 · utility
15Cited by
3References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 19, 2005 |
| Grant date | Feb 17, 2009 |
| Priority date | — |
| Expiry date | Mar 9, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30064
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A system and method for segmenting a structure of interest are provided. The method comprises: segmenting a surface of the structure of interest; and interpolating a border of the structure of interest, wherein the border separates the structure of interest from other structures having similar properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.