Power semiconductor module
US7495324B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 9, 2007 |
| Grant date | Feb 24, 2009 |
| Priority date | — |
| Expiry date | Aug 5, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/144
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A power semiconductor module having an electrically insulating substrate, to be arranged with a circuit board. The circuit board is spaced apart from the substrate by a housing. First conductor tracks are disposed inside the substrate, facing the circuit board, for receiving power semiconductor devices which can be driven by a control IC device. Second conductor tracks are provided on the inside of the circuit board facing the substrate. In the housing, elastic connecting elements are pressure-contacted by a rigid pressure body to establish electrical connection between the first and second conductor tracks. An optimum electromagnetic compatibility is achieved due to the fact that IC conductor tracks and the control IC device are also provided on the inside of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.