Semiconductor apparatus
US7495344B2 · kind B2 · utility
4Cited by
7References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 16, 2005 |
| Grant date | Feb 24, 2009 |
| Priority date | — |
| Expiry date | Mar 16, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor apparatus includes a substrate and elements or semiconductor chips provided on the substrate. The elements are sealed by being brought into contact with a sealing compound. The surface of contact on the elements or the sealing compound is plasma treated. The semiconductor chip is adhesively attached to another semiconductor chip via an adhesive compound. The surface of the semiconductor chip in contact with the adhesive compound is plasma treated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.