Heat dissipation device
US7495912B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Oct 27, 2006 |
| Grant date | Feb 24, 2009 |
| Priority date | — |
| Expiry date | May 11, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation device includes a heat sink (10) in thermal contact with a first heat-generating electronic component. A fan duct (30) receives the heat sink therein and has an inlet (350) and an outlet (302) at opposite sides thereof. A fan (20) is mounted in the fan duct at the inlet. A portion of airflow generated by the fan flows through the heat sink to cool the first heat-generating electronic component. A shutter (31) is mounted on the fan duct. Another portion of the airflow generated by the fan flows through the shutter to blow a second heat-generating electronic component located beside the first heat-generating electronic component and outside the fan duct.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.