Low cost cold plate with film adhesive
US7495916B2 · kind B2 · utility
10Cited by
24References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 19, 2007 |
| Grant date | Feb 24, 2009 |
| Priority date | — |
| Expiry date | Jul 24, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic assembly is constructed with an enclosed fluid-cooled cold plate. Pressurized cooling fluid is propelled through the cold plate to carry away heat from the electronic assembly. The cold plate is constructed from a plurality of enclosure elements which are attached together with a thermally-conductive adhesive. The adhesive may be cured at a low temperature of about 125° C. The cold plate may be produced from thin metal without distortion or warping that might otherwise result from assembly at higher temperatures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.