Spring loaded heat sink retention mechanism
US7495922B2 · kind B2 · utility
11Cited by
7References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 29, 2007 |
| Grant date | Feb 24, 2009 |
| Priority date | — |
| Expiry date | May 18, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods and apparatus to provide a spring loaded heat dissipative device retention mechanism are described. In one embodiment, one or more pins with spring portions are used to maintain a spring force between a heat dissipative device and a printed circuit board. Other embodiments are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.