Method and system for memory thermal load sharing using memory on die termination
US7495985B1 · kind B1 · utility
4Cited by
9References
21Claims
0Family size
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Key dates
| Filing date | Oct 25, 2004 |
| Grant date | Feb 24, 2009 |
| Priority date | — |
| Expiry date | Dec 25, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C7/109
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Memory component temperature information is used to implement a method for ODT (on die termination) thermal load management. A respective temperature of a plurality of memory components are accessed, and based on this temperature, an ODT cycle is directed to a first of the memory components to avoid imposing a thermal load from the ODT cycle on a second of the memory components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.