Integrated thin film explosive micro-detonator
US7497164B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 31, 2007 |
| Grant date | Mar 3, 2009 |
| Priority date | — |
| Expiry date | Oct 31, 2027 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF42C15/184
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of making a thin film explosive detonator includes forming a substrate layer; depositing a metal layer in situ on the substrate layer; and reacting the metal layer to form a primary explosive layer. The method and apparatus formed thereby integrates fabrication of a micro-detonator in a monolithic MEMS structure using “in-situ” production of the explosive material within the apparatus, in sizes with linear dimensions below about 1 mm. The method is applicable to high-volume low-cost manufacturing of MEMS safety-and-arming devices. The apparatus can be initiated either electrically or mechanically at either a single point or multiple points, using energies of less than about 1 mJ.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.