Patent · US Expired

Mold having modular submold

US7497677B1 · kind B1 · utility

10Cited by
77References
8Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 8, 2004
Grant dateMar 3, 2009
Priority date
Expiry dateDec 21, 2025

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB29C45/2675
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

A mold can be receive mold inserts or submolds for customized configuration of the mold. In addition, the submolds can be specially configured for use. The same submold can be changed for a different use. Also, the submold can be reconfigured for use after the submold has been reconditioned. Moreover, the submolds make efficient use of materials within the mold by having many parts that are capable of reuse.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.