Multi-layered connector
US7497741B2 · kind B2 · utility
0Cited by
7References
3Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | May 25, 2007 |
| Grant date | Mar 3, 2009 |
| Priority date | — |
| Expiry date | May 25, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/514
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multi-layered connector is disclosed. The multi-layered connector includes a first sub-connector and a second sub-connector. The first sub-connector includes a first elongated body. The second sub-connector includes a second elongated body, and two side arms elongated upwardly from opposite ends of the second elongated body. The side arms define slide grooves faced to each other for receiving the first sub-connector. The multi-layered connector further includes glue points that connect the first elongated body and the second elongated body. The multi-layered connector avoids solder bridges and solder cracks.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.