Method and apparatus for applying a voltage to a substrate during plating
US7498062B2 · kind B2 · utility
82Cited by
39References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 26, 2004 |
| Grant date | Mar 3, 2009 |
| Priority date | — |
| Expiry date | Nov 9, 2026 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/08
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for applying a strike voltage to one or more substrates during plating. During this method, the substrates are moved in a planetary manner while being held at their exterior edges by a set of parallel mandrels. (The substrates are held in a mutually parallel orientation, typically vertically, during plating.) A voltage is applied to the substrates via a contact pin, a contact plate, a set of ball bearings, a rack end-plate, and the mandrels.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.