Method, apparatus and system for enclosure enhancement
US7499274B2 · kind B2 · utility
1Cited by
10References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 8, 2006 |
| Grant date | Mar 3, 2009 |
| Priority date | — |
| Expiry date | Nov 11, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20963
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In some embodiments, a method, apparatus and system are described for enhancing an enclosure of a device, such as a computing device. The system may include a frame and an apparatus, wherein the apparatus includes the enclosure, which may form a cover of a computing device, and a base. In some embodiments, the enclosure may be composed of materials with different thermal properties when compared to the base. In some embodiments, the enclosure may include vents or openings of various configurations. In some embodiments, the base may be a heat spreader or a heat sink. Other embodiments may be described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.