Multi-chip module with power system
US7499281B2 · kind B2 · utility
29Cited by
11References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 2, 2008 |
| Grant date | Mar 3, 2009 |
| Priority date | — |
| Expiry date | Jan 2, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/1056
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Embodiments include apparatus, methods, and systems having a multi-chip module with a power system. An exemplary electronic module includes a printed circuit board (PCB) having a memory and plural processors. A power system couples to and is disposed vertically above the PCB. A thermal dissipation device is disposed between the power system and the PCB for dissipating heat, via a direct heat exchange, from both the power system and the plural processors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.