Mold system kit
US7500843B2 · kind B2 · utility
10Cited by
76References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 9, 2007 |
| Grant date | Mar 10, 2009 |
| Priority date | — |
| Expiry date | May 9, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49726
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A mold kit and mold which provides for renewal of damaged or worn molds. The mold kit employs spacers to make up for subtractive reconditioning of the mold. A method for renewing the mold is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.