Gas assisted bonding of polymers and polymer composites
US7501039B2 · kind B2 · utility
1Cited by
5References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 17, 2005 |
| Grant date | Mar 10, 2009 |
| Priority date | — |
| Expiry date | Mar 14, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/756
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of bonding materials. The method comprises providing a polymer; providing a second material; contacting the polymer and the second material at a low contact pressure in the absence of a solvent or an adhesive; maintaining the polymer at a temperature less than a bulk Tg of the polymer; introducing a gas at low pressure; and bonding the polymer and the second material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.