Injection molding thermosetting resin composition into reinforcing fiber substrate
US7501087B2 · kind B2 · utility
5Cited by
10References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 26, 2006 |
| Grant date | Mar 10, 2009 |
| Priority date | — |
| Expiry date | Feb 20, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249945
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An epoxy resin composition comprises (a) an epoxy resin, (b) an anionic polymerization initiator and (c) from 1 to 30 parts by weight per 100 parts by weight of epoxy resin (a) of an aromatic ring-containing proton donor of a polyhydric alcohol and/or a polymercaptan.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.