Circuit board device and method for board-to-board connection
US7501584B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 24, 2003 |
| Grant date | Mar 10, 2009 |
| Priority date | — |
| Expiry date | Jun 24, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A structure for connecting substrates to each other, which is capable of thinning an electronic device on which a plurality of circuit boards is mounted, saving a space of the electronic device, and detaching a circuit board from the electronic device. The circuit board unit includes a first substrate including, on a surface thereof, a first group of electrode terminals arranged in a matrix, a second substrate including, on a surface thereof, a second group of electrode terminals arranged in a matrix in alignment with the first group of electrode terminals, and an anisotropic electrical conductor sandwiched between the first and second substrates. The first and second substrates and the anisotropic electrical conductor are pressurized by means of a pressurizer to electrically connect the electrode terminals to each other through the anisotropic electrical conductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.