Apparatus and method for improving printed circuit board signal layer transitions
US7501586B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 29, 2004 |
| Grant date | Mar 10, 2009 |
| Priority date | — |
| Expiry date | May 1, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for improving printed circuit board signal layer transitions are described. In one embodiment, the method includes the formation of a first via within a printed circuit board (PCB). A second via is formed concurrently within the PCB. In one embodiment, the second via is positioned proximate the first via to enable electromagnetic coupling between the first and second vias. Following formation of the second via, the first and second vias are connected to provide a series connection between the first and second vias. In one embodiment, the series connection between the first and second vias reduces a stub length with respect to the first via to reduce and potentially eliminate stub resonance for, for example, short signal layer transitions. Other embodiments are described and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.