Apparatuses and methods for suppressing thermally-induced motion of a workpiece
US7501607B2 · kind B2 · utility
14Cited by
219References
60Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2004 |
| Grant date | Mar 10, 2009 |
| Priority date | — |
| Expiry date | Dec 20, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6875
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Apparatuses and methods for suppressing thermally induced motion of a workpiece. An apparatus includes a workpiece heating system configured to thermally induce motion of a workpiece, and further includes a damping member spaced apart from the workpiece and configured to apply a damping force to dampen the motion of the workpiece. The damping member may be spaced apart from a rest position of the workpiece by a distance sufficiently small that gas pressure between the damping member and the workpiece opposes the motion of the workpiece. The distance is preferably adjustable.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.