Housing for an electronic component
US7501660B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2005 |
| Grant date | Mar 10, 2009 |
| Priority date | — |
| Expiry date | Feb 15, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A housing is specified for an electronic component having at least two connecting parts (4a, 4b), which are partially in contact with the housing. The conductivity of at least subareas of the housing are set in a defined manner and current paths through the housing are formed between the connecting parts. The housing thus has a defined resistance (2), which is connected in parallel with an electronic component (1), and provides ESD protection for the component (1).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.