Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
US7501711B2 · kind B2 · utility
2Cited by
3References
3Claims
0Family size
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Key dates
| Filing date | Oct 18, 2005 |
| Grant date | Mar 10, 2009 |
| Priority date | — |
| Expiry date | Nov 20, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31511
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An epoxy resin composition for semiconductor encapsulation which does not contain conductive foreign metallic particles having such a size that they cannot be detected and eliminated by the conventional method for eliminating conductive foreign metallic particles. The epoxy resin composition for semiconductor encapsulation comprises the following components (A) to (D). Conductive foreign metallic particles having a size of 20 μm or more are substantially not contained in the aforementioned epoxy resin composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.