Methods for manufacturing and testing image sensing devices
US7502066B1 · kind B1 · utility
4Cited by
25References
6Claims
0Family size
Assignee
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Key dates
| Filing date | Nov 5, 2002 |
| Grant date | Mar 10, 2009 |
| Priority date | — |
| Expiry date | Aug 10, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/011
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing an imaging subsystem is provided. The method includes manufacturing an image sensing device including a unique identifier. The image sensing device is incorporated into an imaging subsystem. The imaging subsystem is operated and characterization parameters of the image sensing device operation are determined based thereon. The characterization parameters are associated with the unique identifier in a repository of characterization parameters that is separate from the imaging subsystem.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.