Thermally tuned diode-laser bar package
US7502398B2 · kind B2 · utility
5Cited by
4References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 2, 2006 |
| Grant date | Mar 10, 2009 |
| Priority date | — |
| Expiry date | Nov 16, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/4025
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A directly cooled diode-laser bar package includes a diode-laser bar bonded to a heat-sink. The operating temperature of the diode-laser bar can be selectively varied by varying the thermal impedance of the heat-sink in or near a region of the heat-sink on which the diode-laser bar is bonded. The thermal impedance is selectively varied by varying the insertion depth of screws inserted into corresponding screw holes extending into the heat-sink close to or immediately adjacent the region on which the diode-laser bar is bonded.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.