System and method for cutting soluble scintillator material
US7503831B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2006 |
| Grant date | Mar 17, 2009 |
| Priority date | — |
| Expiry date | Jun 19, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB28D5/0064
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A system and method for cutting soluble scintillator material are disclosed. The system includes a scintillator cutting apparatus including a filament rotated around a plurality of pulleys in at least one direction and in operative proximity to the material thereby cutting the material. The system also includes a linear motion motor operatively connected to the scintillator cutting apparatus for moving the apparatus to position the filament in operative proximity and a linear motion speed sensor for sensing rate of movement of the apparatus as the apparatus is moved by the linear motion motor to position the filament in operative proximity. The system further includes a master motor controller operatively connected to the linear motion motor and the linear motion sensor, wherein the master motor controller controls the linear motion motor as a function of sensed information obtained from the linear motion speed sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.