Method for cleaning semiconductor substrate
US7503982B2 · kind B2 · utility
1Cited by
17References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 5, 2004 |
| Grant date | Mar 17, 2009 |
| Priority date | — |
| Expiry date | Dec 22, 2024 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A method for cleaning a semiconductor substrate having a contact angle between the surface thereof and water dropped thereon of at least 70 degrees comprises contacting the semiconductor surface with a cleaning liquid composition including an aliphatic polycarboxylic acid, an organic solvent having a hydroxyl group and/or an ether group, an anionic surfactant and water.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.