Method of making electro-conductive substrates
US7504131B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 12, 2005 |
| Grant date | Mar 17, 2009 |
| Priority date | — |
| Expiry date | Apr 12, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2967
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
The electro-conductive substrate of the present invention may comprise filaments extruded from a die orifice and at least one metal powder dispensed from a second orifice of the same die unit by way of a gas or liquid carrier. As the polymeric filament is extruded from the die, one or more metal powders may be simultaneously dispensed to coat the surface of the filament. As the polymeric melt and metal powder is extruded, air pressure is impinged upon the metal powder directing the powder toward the extruded filament. The metal powder adheres to the molten polymer as it is extruded for the die, coating the surface of the filament. The metal powder may also be incorporated into the polymeric melt prior to extrusion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.