Method of fabricating self-assembled electrical interconnections
US7504331B2 · kind B2 · utility
3Cited by
15References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 27, 2005 |
| Grant date | Mar 17, 2009 |
| Priority date | — |
| Expiry date | Sep 17, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/083
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of forming a self-assembled interconnect structure is described. In the method, a contact pad surface and particles in a solution are brought together. The particles are selected such that they the particles adhere to the contact pad surface. Formation of a contact is completed by pressing an opposite contact into the particles such that an electrical connection is formed via the particles between the opposite contact pad and the substrate surface contact pad. The described self-assembled interconnect structure is particularly useful in display device fabrication.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.