Electromagnetic interference shields and related manufacturing methods
US7504592B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 31, 2007 |
| Grant date | Mar 17, 2009 |
| Priority date | — |
| Expiry date | Oct 24, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K9/0032
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
According to various aspects, exemplary embodiments are provided of board level shields having single piece constructions. In an exemplary embodiment, a shielding enclosure includes sidewalls and an integral top surface. The sidewalls include upper and lower portions cooperatively defining an interlock therebetween. The upper sidewall portions depend downwardly from the integral top surface. The interlock releasably attaches the integral top surface and upper sidewall portions to the lower sidewall portions. By disengaging the interlock, the integral top surface and upper sidewall portions may then be completely separated from the lower sidewall portions. The integral top surface and upper sidewall portions may also be reattached to the lower sidewall portions by engagement of the interlock.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.