Method of fabricating inkjet printhead
US7506442B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 14, 2006 |
| Grant date | Mar 24, 2009 |
| Priority date | — |
| Expiry date | Jun 1, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49401
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method of fabricating an inkjet printhead. The method of fabricating an inkjet printhead includes sequentially forming an insulating layer, a heater, and an electrode on a substrate and forming a passivation layer on the insulating layer to cover the heater and the electrode; forming a trench that exposes the substrate by sequentially etching the passivation layer and the insulating layer; forming a sacrificial layer to form an ink chamber on the passivation layer to fill the trench; forming a seed layer to provide a plating on the sacrificial layer and the passivation layer; forming a nozzle mold on the seed layer positioned over the heater; forming a plating layer on the seed layer to a predetermined thickness; forming an ink feed hole by etching a rear surface of the substrate to expose the sacrificial layer which is filled in the trench; forming a nozzle by sequentially removing the nozzle mold and the seed layer positioned under the nozzle mold; and forming the ink chamber by removing the sacrificial layer which is exposed by the nozzle and the ink feed hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.