Adhesive mount for a leveling device and a leveling device
US7506450B2 · kind B2 · utility
21Cited by
113References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2006 |
| Grant date | Mar 24, 2009 |
| Priority date | — |
| Expiry date | Jul 7, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1093
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A mount for removably mounting a device to a reference surface is provided. The mount includes a thermoplastic hot melt adhesive, and a tab that extends from the adhesive. The adhesive is configured to adhere to the surface and the device when the device is mounted to the surface. The adhesive is also configured to be removed from the surface without damaging the surface by moving the tab in a direction substantially parallel to the surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.