Liquid cooled thermosiphon for electronic components
US7506682B2 · kind B2 · utility
13Cited by
27References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 21, 2005 |
| Grant date | Mar 24, 2009 |
| Priority date | — |
| Expiry date | Sep 22, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A fluid heat exchanger assembly cools an electronic device with a cooling fluid supplied from a heat extractor (R, F) to an upper portion of a housing. A refrigerant is disposed in a lower portion of the housing for liquid-to-vapor transformation. A partition divides the upper portion of the housing from the lower portion and flow interrupters are disposed in the upper portion for interrupting thermal boundary layer to enhance thermal heat transfer to the flow of liquid coolant through the coolant passage of the upper portion in response to heat transferred by an electronic device to the lower portion of the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.