Cutting elements and bits incorporating the same
US7506698B2 · kind B2 · utility
41Cited by
63References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 29, 2006 |
| Grant date | Mar 24, 2009 |
| Priority date | — |
| Expiry date | Jan 13, 2027 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE21B10/5735
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
Cutting elements and bits incorporating such cutting elements are provided. The cutting elements have a substrate, a first ultra hard material layer formed over the substrate, and a second ultra hard material layer formed over the first ultra hard material layer. The second ultra hard material layer has a thickness in the range of 0.05 mm to 2 mm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.