Cooling arrangement
US7507071B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 1, 2005 |
| Grant date | Mar 24, 2009 |
| Priority date | — |
| Expiry date | Jan 30, 2027 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF05D2260/201
- WIPO fieldEngines, pumps, turbines
- WIPO sectorMechanical engineering
Abstract
A cooling arrangement is provided in which an incident coolant flow is presented to a passage such that a proportion of that flow is diverted in order to create a standing relative overpressure in a chamber compared to the actual static pressure of the flow in the passage. In such circumstances through flow transfer apertures in the walls of the chamber forced coolant flows are presented for impingement upon surfaces and therefore greater heat transfer. Generally, coolant flow is presented to both ends of the chamber in order to create the relative standing overpressure in the chamber relative to the current static pressure presented in the passage through the incident flow. In such circumstances through utilizing the dynamic rotation or other motion of a component incorporating the arrangement a higher relative pressure is achieved for greater force coolant flow projection compared to the incident or actual static pressure of the incident coolant flow in the.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.