Devices using resin wafers and applications thereof

US7507318B2 · kind B2 · utility

Assignee

• UCHICAGO ARGONNE, LLC · US

Inventors

• YuPo J. Lin · Westmont, US
• Michael P. Henry · Batavia, US
• Seth W. Snyder · Providence, US
• Edward J. St. Martin · Libertyville, US
• Michelle Arora · Woodridge, US
• Linda de la Garza · Woodridge, US

Key dates

• Filing date: Mar 17, 2005
• Grant date: Mar 24, 2009
• Expiry date: Jul 18, 2026

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/249953
• WIPO field: Chemical engineering
• WIPO sector: Chemistry

Abstract

Devices incorporating a thin wafer of electrically and ionically conductive porous material made by the method of introducing a mixture of a thermoplastic binder and one or more of anion exchange moieties or cation exchange moieties or mixtures thereof and/or one or more of a protein capture resin and an electrically conductive material into a mold. The mixture is subjected to temperatures in the range of from about 60° C. to about 170° C. at pressures in the range of from about 0 to about 500 psig for a time in the range of from about 1 to about 240 minutes to form thin wafers. Devices include electrodeionization and separative bioreactors in the production of organic and amino acids, alcohols or esters for regenerating cofactors in enzymes and microbial cells.