Reducing dusting of epoxy laminates
US7507471B1 · kind B1 · utility
2Cited by
11References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 10, 1995 |
| Grant date | Mar 24, 2009 |
| Priority date | — |
| Expiry date | Oct 10, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31703
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Epoxy laminates, e.g. CEM-1 laminates, include polymeric particles, particularly core-shell particles having an average diameter of about 0.05 to 30 μm, which reduce the dust produced during manufacture of printed circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.