Device package and methods for the fabrication and testing thereof

US7508065B2 · kind B2 · utility

Assignee

• NUVOTRONICS, INC · US

Inventors

• David W. Sherrer · Radford, US
• Larry J. Rasnake · Blacksburg, US
• John J. Fisher · Taylors, US

Key dates

• Filing date: Oct 31, 2006
• Grant date: Mar 24, 2009
• Expiry date: Oct 31, 2026

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01S5/0222
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the second surface to the layer, the via hole having a first perimeter at the first surface; (d) forming an aperture in the layer, wherein the aperture has a second perimeter within the first perimeter; and (e) providing a conductive structure for sealing the via structure. Also provided are sealed via structures, methods of detecting leakage in a sealed device package, sealed device packages, device packages having cooling structures, and methods of bonding a first component to a second component.