Electronic device, method for manufacturing electronic device, contact hole of electronic device, method for forming contact hole of electronic device
US7508078B2 · kind B2 · utility
1Cited by
3References
63Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2005 |
| Grant date | Mar 24, 2009 |
| Priority date | — |
| Expiry date | Jan 12, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76825
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device includes a substrate, a first conductive material layer formed on the substrate, a patterning layer formed on the first conductive material layer, the patterning layer including first and second patterning layer parts having different critical surface tension, an insulation layer formed on the second patterning layer part of the patterning layer, the insulation layer including first and second insulation layer parts having different critical surface tension, and a second conductive material layer formed on the first patterning layer part and the first insulation layer part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.