Cooling device for an electronic component, especially for a microprocessor

US7508669B2 · kind B2 · utility

Assignee

• Liebert Corporation · US

Inventors

• Harald Fonfara · Lalling, DE
• Herbert Göstl · Zwiesel, DE
• Thorsten Miltkau · Deggendorf, DE
• Markus Eberl · Loiching, DE
• Ralf Mollik · Metten, DE

Key dates

• Filing date: Jun 28, 2004
• Grant date: Mar 24, 2009
• Expiry date: Jan 25, 2025

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A cooling device (1) for an electronic component (3), especially for a microprocessor, includes a heat sink (7, 9), which can be connected to the electronic component (3) to be cooled, such that the waste heat generated by the electronic component (3) is transferred and transported away via a thermal interface of the electronic component (3) on the heat sink (7, 9). The heat sink (7, 9) comprises a first heat sink part (7), which is formed for connection to the electronic component, and a second heat sink part (9), which is connected detachably to the first heat sink part (7), such that a low heat transfer resistance is given, wherein at least the predominant part of the waste heat is transferred to a coolant via the second heat sink part (9). A rack may store several electronic components (3) to be cooled, wherein each electronic component to be cooled is included in a respective system such as respective server for a data-processing system. The electronic components (3) to be cooled are each equipped with a respective cooling device (1) which carries a flow of a liquid medium.