Microfabricated pressure and shear stress sensors
US7509869B2 · kind B2 · utility
15Cited by
10References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 20, 2007 |
| Grant date | Mar 31, 2009 |
| Priority date | — |
| Expiry date | Jul 20, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49103
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A microfabricated pressure sensor. The pressure sensor comprises a raised diaphragm disposed on a substrate. The diaphragm is configured to bend in response to an applied pressure difference. A strain gauge of a conductive material is coupled to a surface of the raised diaphragm and to at least one of the substrate and a piece rigidly connected to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.