Laser bond inspection using annular laser beam
US7509876B1 · kind B1 · utility
22Cited by
23References
24Claims
0Family size
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Key dates
| Filing date | Oct 17, 2007 |
| Grant date | Mar 31, 2009 |
| Priority date | — |
| Expiry date | Oct 17, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N19/04
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Methods, systems, and apparatuses are provided for generation of focused stress waves that selectively apply tensile stress to local regions of a bonded article.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.