Heat dissipation element for cooling electronic devices
US7509995B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 6, 2004 |
| Grant date | Mar 31, 2009 |
| Priority date | — |
| Expiry date | Dec 27, 2025 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F13/00
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat dissipation element for cooling an electronic device is disclosed. The heat dissipation element has a top surface and a bottom surface for mounting the electronic device to be cooled thereto. The top surface defines a heat dissipation area for dissipating heat from the electronic device and a plurality of heat transfer fins project upwardly from the top surface and are coextensive with the heat dissipation area. Each of the heat transfer fins defines a plurality of steps having a rise and a run and each of the steps extend across the heat dissipation area for maximizing an amount of heat dissipated from the electronic device. The heat dissipation element is particularly useful in either one of a cold plate assembly used with a liquid cooled unit (LCU) or a boiler plate assembly used with a thermosiphon cooling unit (TCU).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.