Heat sink
US7509997B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 18, 2006 |
| Grant date | Mar 31, 2009 |
| Priority date | — |
| Expiry date | Aug 18, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink includes a first array of fins defining a plurality of first channels therebetween, a second array of fins disposed at opposite sides of the first array of fins, and a plurality of grooves extending through the first array of fins and the second array of fins. The second array of fins defines a plurality of second channels therebetween. The grooves are intersected with the first channels and the second channels. A bottom extremity of each groove has a curved shape facing upwardly and laterally. A portion of an airflow generated by a fan mounted on a top of the heat sink flows laterally and downwardly through the grooves to leave the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.