Multi-layered thermal sensor for integrated circuits and other layered structures
US7510323B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2006 |
| Grant date | Mar 31, 2009 |
| Priority date | — |
| Expiry date | Apr 22, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K1/14
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A compact resistive thermal sensor is provided for an integrated circuit (IC), wherein different sensor components are placed on different layers of the IC.This allows the lateral area needed for the sensor resistance wire on any particular IC layer to be selectively reduced. In a useful embodiment, a conductive element extending between first and second layers for connecting said first and second conductive paths into a single continuous conductive path having a resistance that varies with temperature.The sensor is responsive to electric current sent through said continuous path for determining temperature proximate to said continuous path from said path resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.