Mold, imprint method, and process for producing chip
US7510388B2 · kind B2 · utility
8Cited by
7References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2006 |
| Grant date | Mar 31, 2009 |
| Priority date | — |
| Expiry date | Jan 16, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F9/7042
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A mold capable of effecting alignment of the mold and the member to be processed with high accuracy even in such a state that a photocurable resin material is disposed between the mold and the member to be processed is constituted by a substrate 2010 formed of a first material and an alignment mark 2102 formed of a second material different from the first material. The first material and the second material have transmittivities to light in a part of an ultraviolet wavelength range of the ultraviolet light. The second material has a refractive index of not less than 1.7.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.