Extended life conditioning disk
US7510463B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 7, 2006 |
| Grant date | Mar 31, 2009 |
| Priority date | — |
| Expiry date | Jun 7, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B53/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention is an apparatus and method for extending the life of abrasive disks used in the conditioning of polishing pads used in chemical mechanical planarization (CMP) of polishing pads used to polish and/or planarize the surfaces of semiconductor wafers during the production of integrated circuits. The invention consists of the a disk comprising a plurality of abrasive segments, each of which is fixed in tangential and radial relationship to one another about the common axis of rotation of the conditioning disk. Means are provided for movement of the abrasive segments, individually or in sets, into or out of the plane of the active abrasive surface of the conditioning disk according to the present invention.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.